Highly customized solutions
Okmetic does both short-term and long-term product development work with many of its customers. Okmetic’s in-house crystal growing and agile operations enable highly customized solutions that are tailored to meet the customer’s product, process and technology needs and that truly generate added value for the customer.
Combination of C-SOI and Through Silicon Via (TSV)
In-built wafer level packing (WLP) offered by the latest advances in bonded Silicon on Soi (SOI) substrates enables the sensor products of tomorrow. Direct wafer level packaging of sensors requires vertical vias in order to enable standard flip-chip assembly. Current state-of- the-art Micro Electro Mechanical Systems (MEMS) production combines cavity SOI substrates with TSVs to enable greatly simplified wafer-level packaging and heterogeneous chip integration using advanced packaging technology. The result is cost-effective standard processes for capping and assembly.