Process and product specific DSP wafers
Okmetic DSP (double side polished) wafers are tailored to meet process and product specific requirements of MEMS sensors. Being a pioneer as a silicon wafer supplier for MEMS sensor applications, Okmetic has been developing DSP wafers for over 20 years now.
DSP wafers make an excellent platform for double-sided litography. Okmetic’s extensive experience and know-how ensures that our DSP wafers have very good thickness uniformity and orientation accuracy, and first-rate crystal quality and homogeneity. We also supply thin DSP wafers that are optimized for fast processing.
General specification
| Diameter | 100, 125, 150, 200 mm |
| Crystal orientation | <100>, <111>, <110>, off-oriented |
| Thickness | trend towards <300 µm |
| Thickness tolerance | ±5 µm (±3 µm for demanding applications) |
| TTV | <1 µm |
| Orientation accuracy | ±.2° (±.1°) |
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Okmetic’s DSP products include cap wafers for anodic, eutectic, fusion and glass frit bonding as well as bulk-optimized wafers for alkali etching (e.g. KOH, TMAH).
In capping, Okmetic’s wafers enable excellent bonding strength and hermetic sealing of MEMS structures.
Wafers optimized of bulk micromachining ensure high accuracy of the sensing elements, stable quality and effective processing.
