
Okmetic’s silicon wafers are tailored to the customers' processes to provide solutions that can improve yield, make processes more efficient and supply a platform for the development of new, advanced applications.
Our understanding of your product, process and technology needs as well as market drivers guarantee that you not only get optimum wafer performance in volume production, but also the confidence to take your own product development even higher.
Okmetic provides a wide range of MEMS sensor-optimized silicon for various leading-edge technologies. Our process and design tailored solutions are the platform for the development of new generation applications and their effective volume production.
Solutions for power, discrete and advanced IC’s

Advanced semiconductor manufacturing demands process-optimized material – Okmetic’s extensive experience in the whole wafer production process, from ingot growing to epitaxial deposition, ensures highly refined solutions.
| Growth method | Cz, MCz |
| Crystal orientation | <100>, <111>, <110> |
| Diameter | 100, 125, 150, 200 mm |
| N type dopants | antimony, arsenic, phosphorus, red phosphorus |
| P type dopants | boron |
| Resistivity | <0.0015 up to 1,500 ohm-cm |
| Backside treatment | etched, BSD, polyback, LTO, polished |

A variety of further developed products:
Okmetic G-SOI - wafer with built-in gettering properties.
Okmetic C-SOI - wafer with pre-etched cavities.
Okmetic 0.3-SOI - wafer with the tightest thickness tolerance in the market
Optimized silicon wafer for encapsulating and protecting MEMS structures
- Okmetic Newsletter 1(2009) -