Bicmos circuit: a semiconductor process that combines different techniques, and aims to be an entity, which combines effectively both digital and analogical functions

BSOI: a value-added silicon wafer, a subgroup of SOI wafers (BSOI = Bonded SOI)

C-SOI: a subgroup of SOI wafers (cavity SOI, product name Okmetic C-SOI); a value-added SOI wafer with built-in buried cavities that enable the processing of more advanced MEMS components

CAP Wafer: a silicon wafer designed to protect sensors

Cavity: embedded structures inside the SOI wafers, fabricated by patterning

DNV: Det Norske Veritas; a multinational company providing services for risk management, one of the most well-known certification bodies in the world

DRIE: Deep Reactive Iion Etching is a highly anisotropic etch process used to create deep, steep-sided holes and trenches in wafers

Epiwafer: a silicon wafer with a thin layer of silicon grown on its surface in an epitaxial reactor

Fab lite -model: a business model, in which the company focuses on its core competencies in its in-house production and increases production capacity by using contract manufacturers

Global Industry Classification Standard (GICS): a global standard for categorising publicly traded companies into industries, which enables company and industry comparisons across countries worldwide

G-SOI: a subgroup of SOI wafers (gettered SOI, product name Okmetic G-SOI); a value-added SOI wafer with built-in gettering properties

Gyroscope: angular velocity sensor, which is used in sensing rotating velocity or orientation

Highly doped wafer: a silicon wafer with extremely high electrical conductivity, containing a high degree of doping element

IATF 16949:2016: the automotive quality management system (QMS) standard that is based on ISO 9001

IFRS: International Financial Reporting Standards that all public companies in the European Union must follow

ISO 14001: an international standard for the management of environmental matters

ISO 9001:2015 an international standard for the management of the quality system used in the company

Lean Six Sigma: process improvement method

Lithography: Exposed the resist by UV-light and then developing the exposed resist areas. The exposed area is defined by photolithography mask.

Low conductivity wafer: a silicon wafer that contains only a little doping to achieve low electrical conductivity

MEMS: Micro Electro Mechanical Systems. 

MIG: MEMS Industry Group

MMC: Micromachine Center

Module: an independent part that can be used to assemble different entities

Oscillator: general description for all systems that produce repetitive signal

Patterning: fabrication of different structures such as cavities on the silicon wafer or SOI wafer using lithography and etching

Polysilicon: the raw material for silicon wafers, high purity polycrystalline silicon

Power semiconductor: a semiconductor component that is used in power electronics

REACH: Registration, Evaluation and Authorisation of Chemicals; EU directive aiming at the identification and phasing out of the most harmful chemical substances

RoHS: Restriction of the Use of Hazardous Substances; EU directive, purpose of which is to approximate the laws of the member states on restrictions of the use of hazardous substances in electrical and electronic equipment

SEMI: Semiconductor Equipment and Materials International; an international umbrella organisation of the semiconductor materials and equipment industry. Okmetic is a member of the organisation

Semiconductor: a material the electrical conductivity of which can be heavily modified by adding appropriate numbers of impurity atoms to it

Sensor: a component that measures a variable or discerns changes in it (an inertial sensor, for example, is used to trigger the airbag in a car)

SIA: Semiconductor Industry Association; an international umbrella organisation of semiconductor manufacturers

Silicon: an element in the fourth main group, the most common raw material for semiconductors

Silicon wafer: a round, thin wafer made from a single crystal of silicon in sizes of 100, 125, 150, 200 or 300 mm, usually mirror finished either on one side or both sides

SIRE: an insider register system

Smart system: miniaturised device that incorporate functions of sensing, actuation, and control. It´s features have been integrated as extensively as possible

SOI wafer: a value added silicon wafer (SOI = Silicon On Insulator) with a sandwich structure: an oxide layer on the silicon wafer, and a thin silicon film on the oxide layer

IATF 16949:2016: a quality standard that the automotive industry has developed for its entire subcontracting chain. IATF 16949:2016 (replaces ISO/TS 16949:2009)

Yield: a ratio that indicates how much of the material put into production comes out according to specifications

Research companies monitoring the sensor and semiconductor markets:

  • Future Horizon
  • Gartner Dataquest
  • IC Insights
  • iSuppli
  • SEMI
  • Semico Research
  • SIA
  • VLSI Research
  • WSTS
  • Yole Développement