Okmetic is attending the Conference on Wafer Bonding on 27–29 November

WaferBond Conference 2017 in Leuven, Belgium

The latest results in wafer bonding technologies and their application in microsystems to be disscussed in the international WaferBond Conference on 27–29 November, 2017.

The conference will cover all aspects of bonding wafers and comparable substrates from basic research to industrial applications.

Okmetic also attending this international conference on wafer bonding for microsystems, 3D and wafer level integration.

Read more: WaferBond Conference 2017