First silicon wafers out from Okmetic new Vantaa fab expansion 

Okmetic, the leading supplier of advanced silicon wafers for MEMS, sensor, RF, and power devices, has successfully produced the first wafers from its new Vantaa fab expansion in Finland. Okmetic Vantaa fab focuses on 150-200 mm silicon and bonded silicon-on-insulator (SOI) wafers with large fab expansion adding 200 mm polished wafer capacity significantly. The completion of the first phase of what will ultimately be 400 million euro expansion, the largest investment in company history, is a significant milestone coinciding with Okmetic’s 40th anniversary. With the first wafers successfully produced, the company is now preparing for sample deliveries to customers, marking the next step in ramping up production.  

Okmetic CEO (second from left) Kai Seikku and EMG members with first 200 mm polished wafers produced in Vantaa fab expansion. 200 mm wafers are expected to remain as key platform for MEMS, RF and Power devices as well as GaN technologies.

“With this expansion, Okmetic strategically positions itself as an EU-based, one-stop supplier catering to all 150 to 200 mm silicon wafer needs in the MEMS, sensor, RF, and Power markets. This strategic shift strengthens our role as a comprehensive wafer supplier and reinforces our commitment to meet the evolving demands of our customers. Increasing 200 mm polished wafer capacity is a crucial step in securing a stable and high-quality wafer supply for critical semiconductor applications”, says President and CEO Kai Seikku

Okmetic Vantaa site produces 150-200 mm silicon and silicon-on-insulator wafers. The newly finished fab expansion is on the right. 

Expansion builds on previous investments to boost capacity and strengthen European silicon wafer supply 

Vantaa site Fab expansion is set to more than double Okmetic capacity by 2030. The construction of the expansion began in early 2023. Spanning over 40,000 m², the expansion includes a 6,000 m² cleanroom area along with crystal growth and wafering areas. The fab expansion is equipped with state-of-the-art technology, with focus on energy efficiency.   

Building on previous investments, Okmetic has significantly expanded its manufacturing capabilities in recent years, including doubling bonded SOI production capacity between 2017 and 2021 and adding a patterning line for Cavity SOI (C-SOI®) production in 2019. 

This latest expansion further strengthens Okmetic’s ability to meet growing semiconductor industry demands. By significantly increasing 200 mm polished wafer capacity, it reinforces Okmetic’s position as a leading supplier of advanced silicon wafers based in Europe, ensuring a stable and high-quality supply of 150–200 mm wafers. 

About Okmetic

Okmetic, founded in 1985, is the leading supplier of advanced, high value-added silicon wafers for the manufacture of MEMS, sensor, RF and power devices. Okmetic has the most extensive 150 to 200 mm wafer portfolio in the market. It comprises MEMS, RFSi® and Power wafer lines including polished wafers, bonded Silicon-On-Insulator (SOI) wafers with or without cavities, patterned wafers and TSV wafers.  

Okmetic’s headquarters is located in Vantaa, Finland, where the majority of the company’s silicon wafers is manufactured. Worldwide sales organization and technical support ensure quick local service, rapid prototyping and highly optimized wafer solutions. Okmetic’s operations rely on quality and environmental systems in line with the ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016 standards.