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Bonded SOI and C-SOI® wafers support high-precision medical MEMS
Okmetic participating in TimeZero initiative
Okmetic leads Finland’s contribution in E2PackMan advancing Europe’s chip packaging
Jim Reed, President of Okmetic Inc. giving speech at Semicon West
Okmetic CTO Atte Haapalinna giving speech at the 2025 International RF-SOI Workshop
Okmetic participating in 2025 IC WORLD Conference
Okmetic Participates in ARCTIC EU Project Consortium Developing Quantum Hardware
Jaska Tuominen is appointed Senior Vice President, Human Resources, Sustainability and Communications
First silicon wafers out from Okmetic new Vantaa fab expansion
Two new whitepapers: Engineered Si wafers for RF devices and silicon/SOI substrates for GaN growth
Okmetic participating in International Microwave Symposium
Okmetic attending PCIM Europe and SENSOR+TEST
The Sustainability Report for 2024 has been published
Okmetic participating in MEMS Engineer Forum
