Okmetic is the leading supplier of advanced, high value-added silicon wafers for the manufacture of MEMS and sensors, RF filters and devices as well as power devices. Our customized silicon wafer solutions enable high-performance devices with lower Total Cost of Ownership.
Okmetic is a true pioneer in silicon wafer business as it has manufactured high value-added silicon wafers since 1985. What makes Okmetic’s silicon wafers unique is that each batch is tailored to the customer’s product, process and technology needs, and manufactured in volume production. This enables highly refined solutions that bring true value for the customer.
Each silicon wafer batch is tailored to the customer’s product, process and technology needs, and manufactured in volume production
Okmetic’s has the most extensive 150 to 200mm silicon wafer portfolio in the market comprising of comprehensive lines of Silicon On Insulator wafers and High Resistivity RFSi® wafers as well as Patterned wafers, Single Side Polished and Double Side Polished wafers, TSV wafers and Wafers for Power devices. Products made by our customers on our silicon wafer solutions can be found in a range of end applications, including smartphones, portable devices, automotive electronics, industrial process control and medical applications, the Internet of Things (IoT), as well as different solutions related to power supply and efficiency improvement.
Advanced silicon wafers
Silicon On Insulator wafers
Produced with over 20 years of expertise Okmetic’s comprehensive line of bonded Silicon On Insulator (SOI) wafers provides an optimal platform for the manufacture of demanding MEMS, sensor, power and RF devices.
Okmetic SSP, DSP and SOI wafers with built-in patterns and buried cavities (C-SOI®) enable more optimized MEMS and RF manufacturing. Fully in-house process covering crystal growth, wafering, lithography, DRIE and fusion bonded SOI guarantee supreme quality and shorter time-to-market.
High Resistivity RFSi® wafers
Okmetic’s comprehensive line of high resistivity RFSi® wafers provides an optimal platform for the manufacture of RF filters and devices. Our high resistivity RFSi® wafers improve RF device performance, TCO and enable more ambitious designs.
Single Side Polished wafers
Okmetic Single Side Polished SSP wafers offer a perfect platform for surface MEMS, capping as well as RF and power devices. In-house crystal growing and wide selection of wafer materials enable the manufacture of customized SSP wafer solutions.
Double Side Polished wafers
Okmetic has been supplying Double Side Polished DSP wafers since 1985 and today they are used as a platform for surface MEMS, capping as well as RF and power devices. Our DSP wafers are tailored to meet each customer’s process and product specific requirements.
Wafers for Power
Okmetic SSP, DSP and SOI wafers optimized for the needs of high-performing power semiconductors include highly doped, low resistivity wafers and medium resistivity wafers with tight resistivity control, low and controlled Oi level as well as zero BMDs.
Okmetic polysilicon filled Through Silicon Vias (TSVs) enable isolated electrical connections to be made through silicon wafers, which help reduce the die size of MEMS devices and enable interlayer electrical connections and 3D MEMS integration. Our silicon wafers with TSVs are used as interposers and capping wafers in variety of sensor applications such as resonators and inertial sensors.