Okmetic is sponsoring the WaferBond’22 conference on 5-6 October
Okmetic is sponsoring the WaferBond’22 conference taking place next week on the campus of the University of Applied Sciences Schmalkalden, Germany.
This year, the conference covers topics from fundamentals of wafer bonding and new developments in wafer bonding technologies to the future of wafer bonding. As a pioneer of Bonded SOI wafers, Okmetic is participating in the conference to hear and discuss leading-edge thoughts on all aspects related to wafer bonding from basic research to industrial applications.
Learn more about this year’s agenda at the event website.