Skip to content
To front page
  • Silicon Wafers
    • SOI Wafers – Silicon-On-Insulator Line
      • BSOI Wafers – Bonded SOI
      • C-SOI® Wafers – Cavity SOI
      • E-SOI® Wafers – Enhanced SOI
    • Patterned Wafers – DRIE and Lithography
    • TSV Wafers – Through Silicon Via
    • RFSi® Wafers – High Resistivity Line for RF
      • High Resistivity Wafers
      • Engineered High Resistivity Wafers with Trap-Rich Layer
      • Engineered Ultra High Resistivity wafers
      • UF-RFSi® – Ultra Flat High Resistivity Wafers
      • High Resistivity BSOI Wafers
      • RF GaN Wafers for GaN-on-Si Applications
    • SSP Wafers – Single Side Polished
    • DSP Wafers – Double Side Polished
    • Wafers for Power
    • Customized Wafers and Prototyping
    • Production and Subcontracting
  • Applications
    • MEMS and Sensors
    • RF Filters and Devices
    • Power Devices
  • Quality and Responsibility
    • Quality
      • Quality Policy
      • Quality Tools
        • Artificial Intelligence at Okmetic
        • 5S at Okmetic
    • Social Responsibility
      • Responsibility for Personnel
      • Responsibility for Safety and Health
      • Responsibility for Environment
      • Business Ethics
      • Managing Responsibility
      • Reports on Responsibility
    • Certificates
  • Work with Us
    • Professionals at Okmetic
    • Production Experts
    • Students
    • Open Positions
    • We are hiring over 500 new employees
  • About Okmetic
    • Company
    • Strategy and Values
    • Executive Management Group
    • Investments
    • Research and Development Work
    • Tale of a Silicon Wafer
    • The History of Okmetic
    • News & Insights
    • Contact Us
  • English
    • Suomi
    • 日本語
    • 中文 (中国)

News & insights

Okmetic+About Okmetic+News & insights

Select content category

  • Career stories
  • Events
  • Insights
  • News
  • Product news
Okmetic news

Okmetic is the gold sponsor of MEMS & Sensors Executive Congress in October

Okmetic news

Okmetic is attending MEMS & Sensors Congress on 1–2 November

Listen to Okmetic – MSIG webinar recording on MEMS substrates evolution and standards

Okmetic news

Okmetic is sponsoring the Europan MEMS Summit in Italy

Coming MEMS events

New MEMS silicon substrate standard helps everyone in the industry – Okmetic greatly involved in SEMI Manufacturing Working Group’s standardization and guideline work

Okmetic at SEMICON China on 27-29 June

Okmetic’s Petri Santala is speaking in MSIG’s upcoming webinar on MEMS substrates evolution and standards

Okmetic appoints Vesa-Pekka Lempinen Chief Quality Officer making quality the highest priority

Okmetic news

Dr. Tzu-Yin Chiu appointed as NSIG’s President

The long-awaited third edition of Handbook of Silicon Based MEMS Materials and Technologies is out now

Okmetic participates in Semicon Europa on 12-15 November

Okmetic’s parent company NSIG listed on the SSE STAR market

Okmetic’s operations are stable despite globally worsening COVID-19 situation

Okmetic’s production running normally

  • Previous
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • Next
  • Silicon Wafers
    • Column
      • SOI Wafers – Silicon-On-Insulator Line
      • Patterned Wafers – DRIE and Lithography
      • TSV Wafers – Through Silicon Via
    • Column
      • RFSi® Wafers – High Resistivity Line for RF
      • SSP Wafers – Single Side Polished
      • DSP Wafers – Double Side Polished
    • Column
      • Wafers for Power
      • Customized Wafers and Prototyping
      • Production and Subcontracting
To front page
  • About Okmetic
  • Contact Us
  • Applications
  • Quality and Responsibility
  • Work with Us
  • Privacy Policy and Terms of Use
LinkedIn Facebook Twitter YouTube