Okmetic leads Finland’s contribution in E2PackMan advancing Europe’s chip packaging
Okmetic is proud to coordinate Finland’s contribution to E2PackMan, a nearly €100 million European Chips JU project led by Infineon Technologies AG. With 60 partners across 13 countries, the project is building a powerful European ecosystem for advanced chip packaging, driving innovation, industrial leadership, and technological sovereignty.
Okmetic is focusing in two key areas:
- RF Packaging: Developing High Resistivity silicon wafers for 6G filters (5–100 GHz), enabling low-loss wafer-level packaging for next-generation high-frequency applications. Through E2PackMan, we are further enhancing the performance of our Engineered High Resistivity wafers and Engineered Ultra High Resistivity wafers, building on their already strong capabilities to meet the most stringent requirements of RF filters and devices, and ensuring minimal unwanted interactions between the RF signal and the silicon substrate.
- MEMS Packaging: Advancing high-quality C-SOI® wafers and TSV interposers to enable reliable hermetic packaging and enhanced performance for next-generation MEMS devices. Through E2PackMan, we are further optimizing these proven platforms, ensuring reliability, streamlining production, and supporting next-generation MEMS performance.
By coordinating national efforts and contributing specialized expertise and advanced silicon wafer solutions, Okmetic ensures Finland plays a strategic role in Europe’s next-generation semiconductor capabilities while further strengthening its own wafer technologies. This approach helps shape next-generation RF and MEMS applications and reinforces Okmetic’s ability to meet evolving industry needs.
