Okmetic at Microelectronics Technology Unified Conference on 16–19 October

New generation of Bonded SOI wafers for demanding applications

Okmetic bonded silicon wafersThe 2017 IEEE S3S Conference will take place October 16th – 19th in San Francisco, CA.

This industry-wide event gathers together widely known experts, contributed papers and invited talks focused on SOI Technology, Low-Voltage Devices/Circuits/Architectures, and 3D Integration.

At the conference Atte Haapalinna, Senior Vice President Products, will give a presentation about 'New generation of Bonded SOI wafers for demanding applications' on Tuesday, October 17 (Session 11: SOI WAFERS).

Read more: IEEE S3S Conference 2017