New generation of Bonded SOI wafers for demanding applications
The 2017 IEEE S3S Conference will take place October 16th – 19th in San Francisco, CA.
This industry-wide event gathers together widely known experts, contributed papers and invited talks focused on SOI Technology, Low-Voltage Devices/Circuits/Architectures, and 3D Integration.
At the conference Atte Haapalinna, Senior Vice President Products, will give a presentation about 'New generation of Bonded SOI wafers for demanding applications' on Tuesday, October 17 (Session 11: SOI WAFERS).
Read more: IEEE S3S Conference 2017