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  • Silicon Wafers 150-200 mm
    • MEMS Wafer Line
      • MEMS SSP and DSP Wafers
      • Selecting the ideal wafer for MEMS devices: Balancing cost, performance, and manufacturing efficiency
    • RFSi® Wafer Line – High Resistivity for RF
      • High Resistivity Wafers
      • Engineered High Resistivity Wafers with Trap-Rich Layer
      • Engineered Ultra High Resistivity wafers
      • UF-RFSi® – Ultra Flat High Resistivity Wafers
      • High Resistivity BSOI Wafers
      • RF GaN Substrate wafers
      • White paper “Advancing from 4G LTE to 5G and 6G: Engineered RFSi® Silicon Wafers for High-Performance RF Devices”
    • Power Wafer Line
      • Power Management SOI wafers
      • Power GaN Substrate wafers (Si and SOI) 
      • Discrete Power Device wafers 
      • White paper: “Enabling next-gen power and RF GaN devices with optimized silicon and SOI substrates” 
    • SOI Wafers – Silicon-On-Insulator Line
      • BSOI Wafers – Bonded SOI
      • C-SOI® Wafers – Cavity SOI
      • E-SOI® Wafers – Enhanced SOI
      • Terrace Free SOI Wafers
    • Patterned Wafers – DRIE and Lithography
    • TSV Wafers – Through Silicon Via
    • DSP Wafers – Double Side Polished
    • SSP Wafers – Single Side Polished
    • EPI Wafers – Epitaxial Silicon Wafers
    • Customized Wafers and Prototyping
    • Production and Capacity Expansion 
    • Supplier Awards and Collaboration Projects
  • Silicon wafers 300 mm
    • Polished silicon wafers 
    • Epitaxial (EPI) silicon wafers 
    • Test and monitor silicon wafers 
  • Applications
    • MEMS and Sensors
    • RF Filters and Devices
    • Power Devices
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Terrace Free SOI: maximizing usable wafer area

Okmetic participating in 20th Silicon Saxony Days

Okmetic participating in Semicon Connect

Okmetic has reduced Scope 1 & 2 emissions by 54%

Okmetic participating in SEMICON Southeast Asia

The Sustainability Report for 2025 has been published

R&D Director Heikki Holmberg speaking at Incize RF Workshop

A summer job launched Hanna Kujanpää’s career in the semiconductor industry

CCO Vuorikari-Antikainen: Okmetic expands wafer portfolio with 300 mm and epitaxial wafers to address broader customer requirements

Okmetic is participating in Applied Power Electronics Conference (APEC)

Okmetic participates in WIBASE – Advancing wide bandgap power electronics

Okmetic Vantaa fab expansion enters volume production

CEO Seikku: Building for the next phase of the semiconductor cycle

Okmetic’s 2025 Year in Review

Okmetic K.K. Reaches 20-Year Milestone in Japan
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    • Silicon Wafers 150-200 mm
    • Silicon Wafers 300 mm
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